It feels like a terrible bad dream. Intel’s LGA1200 attachment for Comet Lake processors isn’t so much as a year old yet, and there are now discusses another attachment for the following year’s 10nm processor.
The most recent Intel archive (by means of @momomo_us) apparently affirms that twelfth Age Birch Lake processors willprobably land with the LGA1700 attachment. Birch Lake-S alludes to the work area processors, while the Birch Lake-P is a riddle until further notice.
Intel’s classification for its attachments has stayed unaltered throughout the years. As the name suggests, the LGA1700 attachment will probably accompany 500 additional pins, which speak to a 41.7% pin increment over the current LGA1200 attachment. It’ll be intriguing to perceive how Intel disperse the extra pins, and whether LGA1700 attachment ends up being more extensive or longer than the LGA1200 attachment.
Typically, the abundance pins are there to convey more capacity to the processor, bolster new highlights or grow I/O abilities. In Birch Lake’s case, it could be the entirety of the previously mentioned. Intel’s ongoing Lakefield processors brought a cross breed structure that consolidates ground-breaking centers with vitality proficient centers, like Arm’s big.LITTLE microarchitecture. The current buzz around town is that Birch Lake could carry this equivalent idea to the work area, and that is apparently affirmed by an ongoing HWinfo update that rundowns Birch Lake as a “cross breed CPU,” which is Intel’s classification for the big.LITTLE-esq execution in Lakefield.
Lakefield mixes one major center with four littler centers into a five-center bundle. Birch Lake, then again, could break spread with a 16-center plan that consolidates eight major centers with eight little centers. Lakefield utilizes Radiant Bay and Tremont for the elite and low-controlled centers, individually.
Birch Lake may use a mix of Brilliant Inlet and Gracemont centers, the first being the replacement to Willow Bay and the last for Tremont. In any case, there isn’t any proof that remotely backs up this theory. The supposed warm breaking point for Birch Lake is 125W and assuming this is the case, it would be on indistinguishable grounds from Comet Lake.
There are significantly increasingly prattle on Birch Lake, and for the present, we should take them with a touch of salt. As far as help, Birch Lake supposedly invites the PCIe 4.0 interface and DDR5 memory. Being a 10nm part, Birch Lake likely use Intel’s Xe illustrations, yet it’s muddled which age of the iGPU will be included inside the chip.